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Wafer Spin Etcher

Polishing and cleaning of wafer edges.

The best quality along the edge zones of the silicon wafer.

The Decker single wafer spin etching system allows you to ensure the best possible wafer quality even along the edge zones.

System characteristics:
High-precision processing of edges by spray etching
Manually operated system, flexible regarding quality and dimensions
Specifically for thyristors of almost all sizes
Other single-wafer applications (pattern/trench etching) possible

Extremely low water and detergent consumption
Sustainably low operating costs
Integrates seamlessly into the production process
Individually tailored system design
Turnkey solution possible

Please contact us for detailed information.

silicon wafer spin etching